Asjad Malik

Asjad Malik is a Microelectronics Packaging Engineer at Allegro MicroSystems since November 2021, where responsibilities include developing advanced product lines for automotive and commercial applications, utilizing Siemens T3ster equipment for thermal characterization in line with JEDEC guidelines, and conducting ANSYS simulations on semiconductor packages. Prior to this role, Asjad served as a Graduate Student Assistant at Arizona State University, supporting coursework in Mechanical Engineering Systems and Robotics-I, and as a Mechanical Design Engineer at Steam Equipments Pvt. Ltd., collaborating on a new unibody design for SS enclosures. Asjad holds a Master of Science in Mechanical Engineering from Arizona State University and a Bachelor of Engineering in Mechanical Engineering from Pune University.