Abu Eghan

Abu Eghan is a seasoned professional in assembly and package engineering, currently serving as Director of Assembly and Package Engineering at Alphawave IP Group since September 2022. Prior to this role, Abu Eghan held the position of Principal Engineer and Director of Assembly & Package Engineering at OpenFive from April 2020 to September 2022, where responsibilities included managing package design and assembly for ASIC customers. Earlier experience includes senior management roles at companies such as SiFive and Open-Silicon, as well as significant contributions at Xilinx Inc. as Principal Engineer in package development, leading teams to advance packaging processes for PLD and FPGA products. Abu Eghan began the career as a Package Engineer at Zilog in 1983 and has been integral in backend assembly and technology transfer. Education was completed at The Ohio State University from 1980 to 1983.