David Arndt

Senior Technical Manager at American Packaging Corporation

David Arndt possesses extensive experience in the packaging industry, serving in various technical and managerial roles at American Packaging Corporation since February 2012, including Senior Technical Manager and COE Technical Manager. Prior experience includes positions at Bemis Co - Milprint Division from September 2004 to November 2011, where David held roles such as Manufacturing Manager and Project Manager/Process Engineer. David Arndt holds a Bachelor of Science degree in Industrial Technology Management from the University of Wisconsin-Platteville, earned from 1997 to 2002.

Location

Wisconsin, United States

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American Packaging Corporation

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American Packaging Corp is one of the top flexible packaging manufacturers & converters serving customers in the USA, Canada, & Mexico since 1902


Employees

1,001-5,000

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