Amkor Technology
Donny Ursee is an accomplished IT professional with extensive experience in infrastructure management and project oversight. Currently serving as Regional IT Infrastructure Team Manager at Amkor Technology, Inc., Donny leads the implementation and maintenance of IT systems, overseeing data center devices and project budgets. Previous roles include IT Manager at Amkor Technology Malaysia, IT Project Manager at ExxonMobil, and Project Manager for a Healthcare Information System at SAINS. With a background in Six-Sigma project management at T-Systems and technical support at Dell, Donny possesses a strong foundation in IT infrastructure and customer service. Education includes a Bachelor's Degree in Biological Sciences & Technology from Universiti Sains Malaysia and professional certifications in business studies and customer service management.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.