Amkor Technology
Eric Triplett is an accomplished engineering professional with extensive experience in semiconductor packaging and quality management. Currently serving as the Director of Corporate Quality at Amkor Technology, Inc., since October 2018, Eric is a certified VDA 6.3 Lead Process Auditor and the company's subject matter expert on VDA audits. Previously, Eric held the position of Senior Supplier Quality Engineer at Continental, where expertise in automotive process quality was developed. Eric's career began at Motorola, where significant roles included managing packaging and new product introductions for both automotive and wireless products, yielding impressive product lifetimes and revenue contributions. Eric holds a Master of Science and Bachelor of Science in Mechanical Engineering from The University of Texas at Austin.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.