Amkor Technology
Gerard John is a seasoned professional with extensive experience in semiconductor assembly and test, currently serving as Senior Director FCBGA at Amkor Technology, Inc. since October 2005. Notable achievements include establishing a new production line in Porto, Portugal, focused on advanced semiconductor capabilities for AI, ML, and automotive applications, as well as leading various teams in developing innovative test solutions and growing business units. Prior roles include significant contributions at Conexant, Qualcomm, and Motorola Mobility, complemented by an educational background that includes a Bachelor of Engineering in Electrical, Electronics and Communications Engineering, an MBA, and ongoing studies in Space Systems IoT Engineering.
Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.