Jessie Tovera

Jessie Tovera has extensive experience in the semiconductor industry, currently serving as Director of Test TPM at Amkor Technology, Inc. since July 2017. Previously, Jessie held the position of Chief Engineer for MEMS Assembly and Packaging at Panasonic USA from December 2016 to July 2017, and served as Sr MEMS Development Engineer at Qualtre Inc. / Panasonic from July 2011 to July 2017, focusing on assembly, packaging, and testing. Earlier roles include Final Test Engineer at Axcelis Technologies and various test engineering positions at STATS ChipPAC and Texas Instruments. Jessie holds a Bachelor's degree in Electronics and Communications from Saint Louis University (PH).