Amkor Technology
Nasoha Amran has extensive experience in the semiconductor and engineering industries, currently serving as a Production Manager at Amkor Technology, Inc. since 2018. Prior to this role, Nasoha was a Process Engineer specializing in Final Test at ON Semiconductor from 2016 to 2018. Nasoha began a career in engineering as an Equipment Engineer in Assembly at ON Semiconductor and gained foundational experience as a Mechanical Engineering Intern at Porsche AG from 2015 to 2016. Nasoha holds a Bachelor's degree in Mechanical Engineering from Universiti Teknikal Malaysia Melaka, completed in 2016.
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Amkor Technology
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Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.