Nozad Karim

Nozad Karim has over four decades of experience in electrical engineering and system integration, currently serving as Vice President of SiP/System Integration and Electrical Engineering at Amkor Technology since 1997. Throughout the career at Amkor, roles have included leadership positions in application engineering, package characterization, and RF system design. Prior to Amkor, Nozad Karim held a principal engineer position at Compaq Computer, focusing on ASIC and microprocessor packaging technologies, and served as a senior RF design engineer at Texas Instruments, contributing to satellite and avionics systems. The early career includes work as an RF design engineer at Motorola, developing communication components. Educational qualifications include an MBA in Global Management from the University of Phoenix and advanced degrees in Electronic Communications and RF Engineering from Southern Methodist University and the University at Buffalo, respectively.