Amkor Technology, Inc. is a provider of outsourced semiconductor packaging and test services. The Company's packaging and test services are designed to meet application and chip specific requirements, including the type of interconnect technology; size, thickness and electrical, and mechanical and thermal performance. It provides packaging and test services, including semiconductor wafer bump, wafer probe, wafer backgrind, package design, packaging, system-level, and final test and drop shipment services. The Company provides its services to integrated device manufacturers (IDMs), fabless semiconductor companies and contract foundries. IDMs design, manufacture, package and test semiconductors in their own facilities. The Company offers a range of advanced and mainstream packaging and test services. The Company's mainstream packages include leadframe packages, substrate-based wirebond packages and micro-electro-mechanical systems packages.

Semiconductor

Amkor Technology

Giel Rutten

Megan Faust

John Stone

Mark Rogers

Steve Shin

The Leadership Team at Amkor Technology is responsible for setting the strategic direction and overall vision of the company. This team collaborates to drive growth, oversee operational efficiency, and ensure compliance with legal and corporate governance standards. By leveraging their extensive expertise in sales, finance, manufacturing, and legal affairs, they prioritize innovation and market responsiveness in delivering high-quality semiconductor packaging and test services.

Leadership Team

Technology and Engineering Team

Operations and Facilities Team

Human Resources and Governance Team

Leadership Team

About

Team members

Other teams at Amkor Technology

Technology and Engineering Team

Operations and Facilities Team

Human Resources and Governance Team