Khuong Nguyen

Khuong Nguyen is a seasoned Senior IC Package and PCB Design Engineer with extensive experience in the electronics industry. Currently at Ampere Computing since January 2018, Khuong specializes in IC substrate design, focusing on FCLGA, HDL, and chiplet packaging. Previously, Khuong contributed as a PCB Design Engineer at Robert Bosch Business and Solutions Vietnam from April 2016 to January 2018, where the role involved benchmarking automotive products. Earlier experience includes PCB design for HDI technology related to mobile devices and computers at JY Technology Vietnam from August 2012 to December 2015. Khuong holds a Bachelor's degree in Electrical and Electronics Engineering from Ho Chi Minh City University of Technology, earned between 2007 and 2012.