Tiewling Yu

Tiewling Yu has over 20 years of work experience in the engineering field. Tiewling began their career in 1999 as a Test Engineer at AMCC. In 2001, they moved to GlobespanVirata as a Test Engineer. Tiewling then moved to Centillium in 2003 where they held the same role. In 2004, they joined Cortina Systems as a Senior Test Engineer, where they were the first test developer and product engineer to support the first 10G signal conditional device on 93K and bench testing. Tiewling also created schematics with multi-chip loadboards derived from system boards with tight signal integrity and cabling. In 2015, they moved to LTX-Credence as an Applications Engineer. In 2016, they joined MACOM as a Principal Product Engineer. In 2019, they moved to Renesas Electronics as an ATE Validation Engineer. In 2020, they joined Intel Corporation as a Research and Development Test Engineer. Finally, in 2021, they began their current role as a Product Test Manager at AnDAPT.

Tiewling Yu holds a Bachelor of Science in Electrical and Electronics Engineering from Oklahoma State University.