Andrew Brown

Packaging Substrate Engineer

Andrew Brown is a Packaging Substrate Technologist at Apple, leveraging over 5 years of experience in substrate packaging process development and pathfinding. They have a proven track record of managing product certification and milestones, working collaboratively with cross-functional teams and external suppliers. Prior to Apple, Andrew served as a Technical Program Manager at Intel, focusing on HVM certification for substrate suppliers and held roles in materials pathfinding. They also have experience as an Account Manager and Business Development Engineer at Samsung Semiconductor. Andrew holds a PhD in Inorganic Chemistry from Texas A&M University and a BS in Chemistry from Westminster College, along with 28 accepted patent applications and several publications in peer-reviewed journals.

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United States

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