Hsiu-Ping Wei is an experienced IC Packaging Engineer currently working at 美商蘋果電腦股份有限公司 since 2018. Previously, Hsiu-Ping served as a Patent Engineer at Louis International Patent Office, where they drafted patent applications and conducted competitive intelligence searches. They also worked as a Senior R&D Engineer at TSMC, focusing on chip-package interaction investigations. Hsiu-Ping earned a PhD in Mechanical Engineering from the University of Maryland, College Park, where their research centered on stochastic reliability assessment of microelectronic package products, and holds a Master of Science and a Bachelor of Science in Power Mechanical Engineering from National Tsing Hua University.
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