Jihoon Oh is an experienced IC packaging engineer with a Bachelor's degree in Mechanical Engineering from Chosun University. Jihoon's career includes positions at Broadcom from January 2011 to April 2013, where responsibilities involved collaborating with marketing and chip leads, providing technical guidance for IC packaging, and managing package qualification tests. Subsequently, Jihoon worked at Qualcomm as a Senior Staff IC Package Engineer from May 2017 to January 2019, focusing on low-cost package designs and technology evaluations. Currently, Jihoon is employed at Apple in the same capacity. Previous experience also includes positions at Intel Corporation and STATS ChipPAC, emphasizing IC package design and collaboration with manufacturing teams.
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