Lân Hoàng

Lân Hoàng has extensive experience in manufacturing and packaging engineering, particularly in the semiconductor industry. With a career spanning over two decades, Lân held positions at leading companies, including Apple, where responsibilities included driving strategic initiatives for factory quality and developing data tools for KPI tracking as a Manufacturing Technologist. As a Research and Development Manager, Lân managed teams focused on miniaturization technologies that reduced costs and environmental impact. Prior roles include Senior Director of Flip Chip Engineering at JCET Group, overseeing the development of manufacturing processes for international markets, and Senior Package Development Manager at AMD, leading a team to collaborate with silicon design for new product launches. Earlier in the career, roles included Senior Packaging Engineer at Broadcom, where Lân focused on developing underfill processes, and Packaging Engineer at Texas Instruments, exploring new flip chip technologies in collaboration with industry groups.