Menglu Li is an accomplished IC packaging engineer with extensive experience in the semiconductor industry. Li began a career at Qualcomm in April 2016 and transitioned to Apple in March 2017, where current contributions continue. Prior to this, Li served as a Research Assistant at UCLA from September 2012 to April 2016, focusing on reliability issues in 3D IC technology. Li holds a Doctor of Philosophy (Ph.D.) in Materials Engineering from the University of California, Los Angeles, awarded in 2016, and a Bachelor's Degree with a double major in Materials Science and English from Shanghai Jiao Tong University, completed in 2012.
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