Brian Cohen is an experienced engineer specializing in semiconductor development and process integration, currently working as a Process Integration Engineer at Applied Materials since October 2018. Prior positions include EUV Lithography Engineer and Semiconductor Development Engineer at GLOBALFOUNDRIES, where expertise in Metal-Gate and Middle-of-Line processes for advanced technologies was developed. Brian's earlier roles include Semiconductor Development Process Engineer at IBM, focused on back-end-of-line metallization, and research positions at SUNY Polytechnic Institute and the College of Nanoscale Science and Engineering, with a background in bioengineering nanoscale virus capsids for cancer treatment. Brian holds a Ph.D. and an M.S. in Nanoscale Science & Engineering from the College of Nanoscale Science & Engineering and an M.S. in Biology with a concentration in Forensic Molecular Biology from the University at Albany.
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