Carl Hoff is a highly experienced professional in the semiconductor industry, currently serving as a TechEdge Applications Engineer IV at Applied Materials since April 2021. Hoff specializes in setting up and deploying optimized data collection plans, connecting tools with the FSS server, and leading the deployment of complex TechEdge applications and models. Prior experience includes roles such as a Senior Field Process Engineer II at ASM, where research and optimization of epitaxy processes were the focus, and Process Engineer roles at companies including Intel Corporation and Diodes Inc, managing multiple deposition tools. Hoff began a career in academia as a research assistant at Michigan State University and has a Ph.D. in Physics from the same institution, complemented by a B.S. in Physics from Murray State University.
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