Kun Li

Kun Li is a Senior Process Integration Engineer at Applied Materials since January 2022, specializing in R&D for cutting-edge BSI CMOS Image Sensors and thermal interface material integration. Prior experience includes a role as a Process Integration Engineer at Applied Materials and a doctoral student at The University of Texas at Austin from August 2016 to December 2021. During a brief internship at Western Digital in summer 2021, Kun Li contributed to advanced device fabrication technologies. Educational qualifications include a Ph.D. in Electrical Engineering from The University of Texas at Austin, a Master's degree from Xidian University, and a Bachelor's degree from Nanjing University of Aeronautics and Astronautics, all in Electrical Engineering.