RuoYu Wang

Senior Manager, Packaging Architecture

RuoYu Wang is a technology manager specializing in multi-physics field simulation and system development for advanced packaging equipment. With over 20 years of experience in semiconductor devices and advanced packaging technologies, RuoYu has a strong background in material and device R&D, including expertise in 2D transistors and GaN power devices. Currently serving as a Senior Manager at Applied Materials, RuoYu leads cross-functional teams to develop and validate packaging equipment modules. Previously, RuoYu held roles as a Senior Component Engineer at onsemi and a Process Development Engineer at L3 Technologies. RuoYu is currently pursuing both a Bachelor's and a Master's degree at Columbia University in Electrical and Electronics Engineering and Materials Science and Engineering, respectively.

Location

United States

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