Rich Thaik

Rich Thaik began their career in 2000 as a Hardware Engineer at Redback Networks. In 2005, they moved to Montalvo Systems as a Performance Architect. In 2008, they joined Sun Microsystems as a Member Technical Staff. In 2009, they joined Veloce Technologies as a Performance Architect and was responsible for micro-architecture and design of the front end unit of a superscalar OOO processor core. Rich also led analysis of performance bottlenecks and optimization micro-architecture of the entire processor core and memory hierarchy. In 2012, they moved to AppliedMicro / Veloce Technologies as Performance Architect and Director of Packaging. Here, they led analysis of software bottlenecks for various benchmarks and worked closely with Theobroma to optimize code generation for optimal core performance. Rich also took over responsibilities for all APM packaging including design, electrical, thermal, mechanical, and assembly requirements. In 2019, they joined Aril Inc. as a Design Engineer.

Rich Thaik received their MS in Electrical Engineering from the University of Illinois Urbana-Champaign in 1991. Prior to that, they attended Purdue University.