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Connie Lin

Regional Corporate Communications Manager - Asia at ASM International NV

Connie Lin is a seasoned marketing and communications professional with extensive experience across various industries in the Asia-Pacific region. Currently serving as the Regional Corporate Communications Manager for ASM since October 2022, Connie oversees brand and communication strategies across key markets including Singapore, Taiwan, China, Korea, and Japan. Prior roles include Marketing & Public Relations Manager at SEMI, where leadership of the Taiwan marketing team was a key responsibility, and Product Marketing Director at Cloud Mile Inc., focusing on Cloud, AI, and CDN solutions. Previous experience includes significant marketing roles at Nogle Limited, Microsoft, MediaTek, and Elite PR Group, where competencies ranged from product marketing to corporate branding and crisis management. Connie holds a Master’s degree in Strategic Marketing and Consulting from the University of Birmingham and a Bachelor’s degree in Foreign Languages and Literatures from National Tsing Hua University.

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ASM International NV

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ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.


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1,001-5,000

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