Jaewoo Jeong

Jaewoo Jeong is an accomplished engineer specializing in semiconductor processes with a focus on PEALD and PECVD at ASM since January 2022. Prior experience includes roles as an Installation Engineer at KLA and as an Electoplating Process Engineer at Ebara Corporation, where expertise was developed in electroplating for semiconductor packaging. Jaewoo also gained knowledge in advanced processes such as FOWLP, FOPLP, TSV, RDL, and UBM. Educational qualifications include a Master of Science in Precision Manufacturing Systems from Pusan National University, where the focus was on MEMS processes, and a Bachelor's degree in Mechanical Engineering from the same institution.