ASM International NV
Jinglun L. is a Senior Thermal Mechanical Engineer I at ASM, specializing in the product design of advanced atomic layer deposition (ALD) chamber components since January 2024. Prior to this role, Jinglun served as a Senior FEA Simulation Engineer at NXP Semiconductors, where responsibilities included implementing static beam theory and finite element analysis to enhance material selection and part design from July 2021 to November 2023. Jinglun's academic background includes a PhD in Mechanical Engineering from Rensselaer Polytechnic Institute, where research focused on the design, simulation, and testing of inertial sensors as a Research Assistant from September 2016 to March 2021. Additional experiences include internships and research roles at Nokia Bell Labs, Brookhaven National Laboratory, and SMIC, contributing to the development and optimization of mechanical systems and processes.
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ASM International NV
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ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.