Jinglun L.

Jinglun L. is a Senior Thermal Mechanical Engineer I at ASM, specializing in the product design of advanced atomic layer deposition (ALD) chamber components since January 2024. Prior to this role, Jinglun served as a Senior FEA Simulation Engineer at NXP Semiconductors, where responsibilities included implementing static beam theory and finite element analysis to enhance material selection and part design from July 2021 to November 2023. Jinglun's academic background includes a PhD in Mechanical Engineering from Rensselaer Polytechnic Institute, where research focused on the design, simulation, and testing of inertial sensors as a Research Assistant from September 2016 to March 2021. Additional experiences include internships and research roles at Nokia Bell Labs, Brookhaven National Laboratory, and SMIC, contributing to the development and optimization of mechanical systems and processes.