Wade Pfennig

Senior Field Service Engineer at ASM International NV

Wade Pfennig is a seasoned professional in engineering and technical services, currently serving as a Senior Field Service Engineer at ASM since August 2021. In this role, Wade collaborates with customers to develop installation and upgrade schedules and coordinates spare parts management plans. Wade's extensive experience includes positions such as Field Service Engineer and Engineer in Charge, wherein troubleshooting and repairing complex electronic, mechanical, and software systems have been key responsibilities. Prior to ASM, Wade worked at SUSS MicroTec and Eugenus, Inc., focusing on semiconductor equipment and system maintenance. Wade also has a diverse background in scuba diving instruction and home automation systems, along with early experience in production management and manufacturing engineering at companies like SUEZ and Hughes Aircraft Company. Wade holds a Bachelor of Science degree in Electronics Engineering Technology from DeVry Institute of Technology.

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ASM International NV

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ASM International N.V. is a supplier of wafer processing equipment, primarily for semiconductor manufacturing industry. The Company designs, manufactures and sells equipment and services to its customers for the production of semiconductor devices, or integrated circuits (ICs). The Company operates in two segments, which include Front-end and Back-end. The Front-end segment manufactures and sells equipment used in wafer processing, encompassing the fabrication steps in which silicon wafers are layered with semiconductor devices. The front-end segment includes manufacturing, service, and sales operations in Europe, the United States, Japan and South East Asia. The Back-end segment manufactures and sells equipment and materials used in assembly and packaging, encompassing the processes in which silicon wafers are separated into individual circuits. The Company supplies equipment to the manufacturers of analog semiconductor devices primarily for the deposition of thin films.


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1,001-5,000

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