Wei-Hsun Chen is a seasoned Sr. Materials Scientist at ASML since August 2014, specializing in extreme ultraviolet (EUV) lithography technology, where responsibilities include component design, material selection, and reliability testing. Previous experience includes a Graduate Research Assistant role at Purdue University from August 2009 to July 2014, focusing on stress relaxation behaviors in solder films, and a Package Failure Analysis Internship at Intel Corporation in summer 2013. Wei-Hsun also held positions as a Research Assistant at Academia Sinica, studying nanobubble formation in tungsten oxide films, and as an Undergraduate Researcher at National Taiwan University, engaging in electromagnetic wave propagation and cryogenic cooling research. Wei-Hsun earned a Ph.D. in Materials Engineering from Purdue University, an MS in Physics from National Taiwan University, and a Bachelor's degree in Physics from the same institution.
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