Yifei Meng is a Senior Software Engineer at ASML, specializing in the design and development of computer vision AI software for wafer inspection and metrology in the semiconductor industry. Prior experience includes serving as a Data Science Manager and Scientist at Eurofins | EAG Laboratories, where Yifei focused on enterprise AI/machine learning applications for testing and quality control across various sectors, as well as developing tools for microscope image processing. Additional roles include Postdoctoral Research Associate at Berkeley Lab, where Yifei processed large datasets using CUDA, and Graduate Research Assistant at the University of Illinois at Urbana-Champaign, conducting local strain analysis and 3D tomography research. Yifei Meng holds a PhD in Materials Engineering from the University of Illinois Urbana-Champaign and a BS in Chemistry and Physics from Nanjing University.
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