Tengbin Wang

Tengbin WANG (Benjamin) has work experience in the field of semiconductor packaging and assembly processes. Tengbin worked as a Senior Lead Engineer at the Hong Kong Applied Science and Technology Research Institute, where they focused on package development and prototyping for Si based and SiC power devices and modules. Prior to that, they worked at ASM Pacific Technology Ltd. as a Senior Process Engineer, where they conducted in-depth process studies and optimization of die attach and dispensing technology for 12 Inch High Precision Die Bonder. Tengbin also held positions as a Process Engineer I and Process Engineer II at ASM Pacific Technology Ltd.

Tengbin Wang (Benjamin) has a diverse education history. Tengbin obtained a Master of Science degree in Chemical and Biomolecular Engineering from The Hong Kong University of Science and Technology in 2015. Prior to that, they completed their Bachelor of Engineering degree in Material Science and Engineering from Central South University, graduating in 2014. During their undergraduate studies, they were also an exchange student at the University of Science and Technology Beijing from 2012 to 2013.

Additionally, Tengbin Wang has pursued various certifications to enhance their skills. These include a Semiconductor Packaging certification from Coursera, obtained in July 2023. Prior to that, they obtained certifications in Project Execution: Running the Project (Google) in January 2022, IBM Data Science Professional Certificate (10 Courses) in September 2021, Data Analysis with Python in July 2021, Python for Data Science, AI & Development in April 2021, and Google Project Management in March 2021.