Jonathan Eiswerth is an experienced packaging engineer with a solid background in the medical device and clinical packaging industries. Currently serving as a Senior Packaging Engineer at ATEC Spine since June 2025, Jonathan previously held roles as a Senior Packaging Engineer 2 and Senior Packaging Engineer at Enovis from October 2019 to November 2024. Prior experience includes a contract position as a Packaging Engineer at Dexcom and an engineering role at Sherpa Clinical Packaging. Jonathan also worked as a Packaging Lead on a contract basis with Diageo and completed a Technical Operations Packaging Co-op at Johnson & Johnson. Earlier experiences include interning as a Mechanical Engineering intern at Autoliv. Jonathan holds a Bachelor's degree in Packaging Engineering from Michigan State University, obtained from 2012 to 2016, and graduated from Walled Lake Central High School between 2009 and 2012.
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