Hee Bum Shin

Hee Bum Shin is a seasoned professional in the field of copper plating with extensive experience in application engineering and research and development. Currently serving as Global Application Manager at Atotech Group since March 2012, Hee Bum Shin has been instrumental in overseeing copper plating processes and developing innovative techniques. Prior experience includes a Senior Engineer role at Samsung Electro-Mechanics, where responsibilities encompassed R&D engineering, project leadership, and process development for high-density interconnect (HDI) and ball grid array (BGA) applications. Earlier career experience includes a position as a Process Engineer at Korea Circuit Co Ltd, focusing on process control and troubleshooting for PCB manufacturing. Hee Bum Shin holds a Bachelor's degree in Chemical Engineering from The University of Suwon.