APIE is a global manufacturer of high-technology equipment specializing in advanced semiconductor packaging systems such as thermo-compression bonder (TCB) and wafer-level hybrid bonding (HB). Holders of bachelor’ s, master’ s, and doctoral degrees account for over 60% of our workforce. Our systems are used primarily in advanced packaging for HBM (high-bandwidth memory), high-performance CPUs/GPUs, and 2.5D/3D packaging for AI chips. 
APIE’ s core technical and management team comprises seasoned experts from leading global semiconductor companies, each with 10 to 30 years of industry experience on average. Backed by a world-class founding team and a track record of high-quality delivery and service, APIE has earned recognition from top-tier semiconductor OSATs, IDMs, and camera-module manufacturers worldwide. With stable HVM (high-volume manufacturing) capacity, we are committed to creating value for our clients.
With a mission to drive the advancement of global precision intelligent manufacturing, APIE aims to become a global leader in precision pick and place technology. We remain customer-focused and strive to provide innovative micro-/nano-scale, high-tech equipment for advanced semiconductor packaging.

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