Axus Technology delivers advanced process development expertise, equipment, and service support for:
     -- CMP & Polishing
     -- Wafer Thinning and Grinding 
     -- Edge Grinding and Profline
     -- Substrate Cleaning Applications
     -- Wafer Bonding Applications.

Axus'​ customers range from leading-edge production semiconductor manufacturers through small development facilities.  We deliver surface processing solutions to a broad range of technologies, including semiconductor, MEMs device processing, device packaging, TSV/3D Integration, materials processing and development, as well as for virtually any application where material needs to be made flatter, smoother, or thinner.   

Axus Technology supports a global customer base with a high-quality customer support experience known for delivering high quality, and often highly customized, processes and equipment.   

The Axus Technology team works with a broad array of substrates and films, applying fundamental and novel process technologies into new product applications.

Semiconductor

Axus Technology

Dan Trojan

Grazyna Bendisz

Scott Clark

Paul Hendriks

Dennis Webster

The Engineering Team at Axus Technology is responsible for designing, developing, and optimizing advanced equipment and processes for surface processing applications, including CMP, wafer thinning, and bonding. This multidisciplinary team of engineers collaborates on innovative solutions, ensuring high-quality performance and customization to meet the specific needs of a diverse global customer base. They also provide technical support and field services to enhance customer satisfaction and operational efficiency.

Engineering Team

About

Team members

Other teams at Axus Technology

Operations Team