Beckermus Technologies was founded in 1998 by the Beckermus brothers: Oded and Oren.
The founders’ vision was to create an Excellence Center in the field of "Bare Die" assembly services.

The company has evolved alongside growth of the local startup community and expansion of global corporate activity in Israel. Our versatile client base (from R&D/NPI to High Volume production) has optimally qualified us for a worldwide expansion.

Beckermus services are currently available globally, consistently featuring our 3 main fundamental values: high quality, quick response and reasonable pricing.

Prototyping and low-medium volume production is performed at our 750 sqm cleanroom facility. Mass production is performed at our partners’ facilities in the far-east and in Europe receiving our full support and professional liability.

Our main services:
Wire bonding, Encapsulation, Active Alignment, IC packaging, 3D stacked dies, Electro optics and photonics assembly, Die attach, Wafer dicing/sorting, Chip on board/Chip on flex, Flip Chip, Wafer level packaging, 
SiP and MCM.

Our quality standards certifications:
- ISO 13485: Medical devices
- IPC-A-610
- AS9100D aerospace
- MILL-STD 883
- QMS certified

Beckermus Technologies

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