Chenwei Yan

Chenwei Yan serves as a Senior Vice President at Qualcomm since April 2021, previously holding the position of Vice President and General Manager for wireless and connected clients at Intel Corporation from June 2017 to March 2021, where cellular product P&L was managed. Prior roles include Vice President of Sales and Product Marketing at Qualcomm from February 2010 to May 2017, and Chief Operating Officer at Via Telecom from January 2008 to January 2010, where a turnaround from loss to profitability was achieved. Chenwei Yan's experience spans various senior roles at UTStarcom, 3Com - Commworks, Pittiglio, Rabin, Todd, McGrath, and Motorola. Educational qualifications include a BS in Computer and Electrical Engineering from Purdue University, an MSEE in Electrical Engineering from Stanford University, and an MBA in Finance and Strategic Management from The University of Chicago Booth School of Business.