Daniel Esquer is an RF/Microwave Design Engineer with a strong track record in delivering exceptional hardware solutions. They worked as a Senior Radio Frequency Engineer at Lockheed Martin from 2017 to 2021, where they led RF design efforts with a focus on Electronic Scanning Arrays. Previously, from 2013 to 2017, they served as an Electrophysics Engineer at Boeing, designing and testing RF units for satellite payloads and conducting research on phased array technology. Currently, they are a Senior RF Engineer at Boeing, responsible for the design of RF slices and units as well as phased arrays. Daniel holds a Bachelor of Science in Electrical and Electronics Engineering from California State Polytechnic University-Pomona, which they completed in 2012.
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