Timothy Lee is currently the 2025 IEEE USA President and a Boeing Technical Fellow specializing in advanced microelectronics and packaging. They previously served as the IEEE Region 6 Director and on the IEEE Board of Directors from 2021 to 2022. Timothy's work includes leadership in various IEEE initiatives, focusing on technology that benefits humanity, including roles in the Future Networks Technical Community and humanitarian efforts to improve internet access in underserved areas. With a commitment to workforce development and diversity in engineering, Timothy is also actively involved in promoting the US CHIPS Act to enhance semiconductor education and engagement across communities. They are pursuing a degree in Electrical and Electronics Engineering at the Massachusetts Institute of Technology.
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