Valerie C. is a Senior Electronics Packaging Design and Analysis Engineer at Boeing, where they lead innovative projects and mentor team members. Previously, Valerie contributed to significant advancements in electronic components and packaging designs while working at Boeing and held internships at Apple and General Atomics Aeronautical Systems, Inc. Valerie also conducted undergraduate research at UC Berkeley's Microfluidics and Ballistics Impact Laboratories, achieving recognition at various conferences. Valerie earned both a Bachelor of Science and a Master of Science in Mechanical Engineering from the University of California, Berkeley.
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