Renaldi Renaldi is an accomplished engineering professional with extensive experience in the technology sector, currently serving as Vice President of Engineering at Boku since September 2017. Renaldi has led multiple product engineering teams focused on Payment and Subscription products, efficiently managing high transaction volumes. Prior roles include Director of Product Engineering and Engineering Manager, as well as Engineering Team Lead for Boku's payment gateway product, which supports major merchants. Renaldi's background includes software engineering roles at Boku Inc and Currenex, where contributions involved developing high-volume distributed systems and enhancing legacy code maintainability. Academic background includes a Bachelor of Science in Electrical Engineering and Computer Science from the University of California, Berkeley.
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