Philip Yick is a seasoned telecommunications professional with extensive experience in business development and solution engineering. Currently serving as Vice President of Business Development at Boldyn Networks since September 2023, Philip previously held key roles at Huawei from November 2008 to August 2023, including Solution Director, where responsibilities included designing innovative network architectures for 5G and digital transformation, as well as winning significant projects through competitive analysis. Prior experience includes positions as Product Manager at Huawei and Systems Engineer at Motorola Asia Pacific, where contributions led to substantial telecom project wins. Philip holds a Master of Science in Telecommunications and a Bachelor of Engineering in Electronic Engineering from The Hong Kong University of Science and Technology.
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