Dan Burgess

Dan Burgess is an accomplished Associate Sr. Fellow and Packaging Engineer at Boston Scientific since January 2006, with extensive experience in packaging standards development as evidenced by a leadership role as Chair of the F02 Primary Barrier Packaging Committee and Subchair of the F2.50 Package Design and Development Committee at ASTM International from 2014 to December 2023. Dan's earlier career includes roles such as Journeyman Moldmaker at Stellar Mold & Tool, Inc., where over 100 production plastic injection molds were designed and constructed, and a Moldmaking Apprentice at Compression Engineering. Dan holds a Master's degree in Technology Management from the University of St. Thomas and a Bachelor's degree in Packaging from the University of Wisconsin-Stout, complemented by various specialized courses and a solid foundation in moldmaking and machine tool technics.