Carl (Ming-Jui) Li is an experienced IC Packaging Design Engineer currently employed at Broadcom since September 2025. Prior to this role, Carl worked as an IC Packaging Technologist at Thintronics® and held positions at Applied Materials as a Semiconductor Packaging Engineer and Technologist, where significant contributions included leading the development of advanced panel-level organic substrates. Academic background includes a Master of Science in Electrical and Computer Engineering as well as a Master of Science in Material Science and Engineering from the Georgia Institute of Technology, complemented by a Bachelor of Engineering in Material Science with a minor in Electrical Engineering from National Cheng Kung University. Research experience encompasses innovations in chip-to-chip bonding and improvements in lithium-ion battery performance through advanced material techniques.
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