Hank C. is a Staff Packaging Engineer at Broadcom Inc., where they have been employed since 2021. They previously held positions such as Principal Engineer at Western Digital and Staff Engineer at TDK InvenSense, among other roles in prominent companies. Hank's educational background includes a Doctorate from the Massachusetts Institute of Technology and both a Master's and Bachelor's degree from National Tsing Hua University. Their extensive experience spans various engineering and research roles, reflecting a strong foundation in packaging engineering.
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