JT

Jeremy Theil

3DIC and Adanced Packaging Architect

Jeremy Theil is a seasoned technology development leader with extensive experience in renewable energy, energy storage, and semiconductor markets. Currently, they serve as a 3DIC and Advanced Packaging Architect at Broadcom Inc., specializing in advanced packaging technologies. Previously, Jeremy held positions such as Director of Materials Development at QuantumScape and Senior R&D Manager at First Solar, where they significantly enhanced product efficiency and drove technology innovation. They also own a technology and management consulting firm focusing on clean energy solutions. Jeremy is currently pursuing a Ph.D. in Materials Science & Engineering at North Carolina State University.

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Mountain View, United States

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