Jiaqi Wu is currently an IC Packaging Engineer at Broadcom, specializing in advanced package technology development. With a Ph.D. from UC Irvine and over five years of experience in electronic packaging and reliability across both industry and academia, Jiaqi has published more than ten academic papers in the field. Previously, they worked as an IC packaging technologist at Intel Corporation, where they contributed to module development and innovative packaging processes. Their research background includes significant expertise in interconnection structures and materials preparation, bolstered by hands-on experience in semiconductor manufacturing and advanced packaging methodologies.
This person is not in the org chart
This person is not in any teams
This person is not in any offices