Qianwen (Wendy) Chen is a Principal Package Engineer at Broadcom since 2024, specializing in semiconductor integration and smart healthcare microsystems. They previously worked at IBM from 2015 to 2024 as a Research Staff Member, focusing on 2.5D/3D integration and micro-system technology. Prior to that, Qianwen conducted postdoctoral research at Tsinghua University from 2011 to 2013. Qianwen earned a PhD in Electrical and Electronics Engineering from Tsinghua University in 2011 and also served as a Research Scholar at Rensselaer Polytechnic Institute during 2009-2010.
Location
Fort Collins, United States
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