Rob Martin is a Principal Packaging Engineer at Broadcom, where they have worked since 2011. Previously, they held positions such as Package Development Engineer at VLSI Technology from 1994 to 1999 and Technical Support Manager at AIT (now Unisem Group) from 2000 to 2002. Rob also served as Technical Marketing Manager for Flip Chip Products at STATS ChipPAC from 2009 to 2011. They earned a BA in Business Economics from the University of California, Santa Cruz, and a BS in Mechanical Engineering from the University of California, Berkeley.
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