Damien Saint-Patrice

Damien Saint-patrice is an accomplished professional with extensive experience in research and development, primarily at CEA since 2006. Currently serving as Chef de projet R&D and Responsable intégration filière, Damien has worked on advanced topics such as 3D photonic interconnects for high-performance computing and 3D packaging for LiDAR applications. With a strong background in MEMS technology and thin-film packaging, Damien has authored numerous publications, filed multiple patents, and provided mentorship to students and interns. Previous roles include positions in materials engineering and quality methods across various companies, including SKF Aerospace France and KROHNE Group. Damien holds advanced degrees in materials engineering and physics from recognized institutions, ensuring a solid foundation in both theoretical and practical aspects of engineering.