Yogesh Pai began their career in 2012 as an In-Plant Trainee at Schrieber Dynamix. In 2014, they completed a Student Project at Mega Rubber Technologies Private Limited, where they designed a mechanical system for continuous movement of in-process materials and planned and allocated boiler usage according to capacity for cost optimization. In 2015, Yogesh Pai joined Embry-Riddle Aeronautical University as a Graduate Research Assistant, where they built CFD models, performed experiments and developed analytical solutions & test plan to analyze performance of novel pin fin cooling system for gas turbine blade cooling. Yogesh also served as a LMS Content Specialist and a Graduate Teaching Assistant, where they assisted the teacher in conducting lectures, tests, grading and assisting students with coursework. In 2018, they joined Sensatek Propulsion Technology, Inc. as a Technical Lead, where they were awarded $500,000 as part of the NSF SBIR 2019 Phase II B Grant, $200,000 as part of the NSF TECP & TABA Grant and $500,000 as part of the AFWerx STTR 2020 Phase II Grant. Most recently, in 2021, Yogesh Pai became the Proposal Manager at Censys Technologies Corporation, where their responsibilities include managing proposal submissions and awards for government and private sponsored grants and contracts.
Yogesh Pai is currently pursuing a Master of Science in Project Management at Harrisburg University of Science and Technology, which they are expected to complete in 2022. Prior to this, they obtained a Master's Degree in Aerospace, Aeronautical and Astronautical Engineering from Embry-Riddle Aeronautical University in 2017. Yogesh also holds a Bachelor's Degree in Mechanical Engineering from the University of Mumbai, which they obtained in 2013.
April 1, 2023 - present
June, 2021
Director of Hardware Engineering at Fox Robotics
Director of Hardware Engineering at LeafLabs
Director of Hardware Engineering at Igor
Director Of Hardware Engineering at Owl Autonomous Imaging
Director Of Hardware Engineering at OXOS Medical