Daniel DongWook KIM

Daniel DongWook Kim is an ASIC Engineering Technical Leader at Cisco, specializing in physical design and verification. With extensive experience in RTL to tapeout processes for over 300 tapeouts, including advanced technologies up to 3nm FinFET, they have previously held key roles at companies such as Renesas Electronics, Aquantia, Marvell Semiconductor, and TSMC North America. Daniel has a strong background in multi-million gate designs, high frequency, and low power solutions, alongside expertise in various physical design methodologies. They are currently pursuing degrees in Semiconductor Engineering and Electrical and Electronics Engineering.